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Leadframe

A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages.

Mitsui High-tec accomplished the production of IC leadframes by precision-die-stamping for the first time in the world and, at present, we are producing leadframes not only by stamping but also by chemical etching.

Roadmap for Lead Frame Package

Roadmap for Lead Frame Package

Goal:MSLevel1