IC Assembly
Mitsui High-tec Inc. is tackling the development and mass production of IC package and has prepared abundant product lineup backed up by our ultra-precision technology base having been polished since its foundation in order to respond to customers' demand.
We are internally producing IC leadframes that are the most important components among IC Assembly materials. In addition, by own development of dies, machine tools and jigs, based on our long-accumulated manufacturing technology, we can flexibly respond to the diversified needs arising form development to mass production and supply products in a short delivery term and at a low price.
We will endeavor to meet our customer's demands in the future, centering on our ultra-precision technology base.
Contact Us
Mitsui High-tec, Inc.
2-10-1, Komine,Yahatanishi-ku,Kitakyushu, 807-8588, Japan
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