IC-manufacturing process is divided to pre-process and post-process, and assembling of IC is included in the post-process. Generally, a silicon wafer on which transistors were mounted and circuit was printed in the pre-process is made into a product IC package through the following processes.
[Typical processes]
1. Wafer on the disc is cut into chip units. (Dicing process)
2. A chip is fixed on a leadframe. (Die bonding process)
3. Chip and leadframe terminals are connected with metal wire.
(Wire bonding process)
4. The chip is sealed in epoxy thermosetting resin. (Molding process)
5. Product name is printed. (Marking process)
6. The leadframe is formed into final shape. (Lead forming process)
7. The lead is plated with solder. (External plating process)
(Related pages: IC assembly)
BGA [Ball grid Array]
IC package having ball-shape terminals
A surface-mounted package developed for LSI having much more pins than QFP. Small balls of soldering material called "solder ball" are put on the back face of IC package at a spacing of 50mil (1 mil = 0.0254mm), and the package is mounted on the surface of a printed-circuit board. This technique is suitable for high-density mounting.
(Related pages: IC assembly)
Cam bending
This technique is sometimes adopted as one of the means for lateral bending in case where "die strength is deficient" or "bending of component parts is difficult" by ordinary bending in up-and-down direction.
(Related pages: Precision tooling)
Caulking
A technique to fix a joint not by use of bonding adhesive but by striking or clamping the claw and metal fitting inserted there.
(Related pages: Motor core dies / Features of leadframe 1)
Clearance
This means a space (gap) between tips in machining and between stator and rotor. In the case of stamping die, this means the gap between tips (punch and die) and, keeping this gap proper makes production stable and elongates the life of dies.
(Related pages: Precision parts / Dual stamping die)
CSP [Chip Size Package]
Generic name of IC packages whose size is same or near the chip size. This term is often used for implying an ultra-small package responding to the ultra-compacting tendency in size of communication devices such as mobile phone, camera-integrated VTR and various kinds of portable devices such as portable information devices.
(Related pages: Features of leadframe 2 / Feature of IC assembly)
Cut bending
One of the forming techniques, wherein precutting is made around a portion to be formed on a metal plate and then, by bending, the portion is formed into an intended shape. Main applications of cut-bent products are a hook of spring and a stopper of movable parts.
(Related pages: Precision tooling)
Die
Female tool is called "die", and "die" has various shapes according to the product shape, product accuracy and stamping quantity. Male tool is called "punch". For the tips (punch and die), carbide material is used because of is excellent rigidity and wear resistance.
All kinds of tools may be called die.
(Related pages: Precision parts)
DIP [Dual In-line Package]
A kind of IC package, called through hole mounting package, wherein two rows of IC lead pins are taken out straight downward respectively from two longer sides of a rectangular IC package.
A package of this type is inserted to PCB through holes provided there and soldered, or mounted by use of IC socket. Conventionally this type was often used for ROM, RAM, various ICs and processors up to 16 bits. However, in recent years, this type has been replaced with surface-mounted packages such as SOP and QFP having advantages in the mounting area, etc.
(Related pages: IC assembly)
Dressing
A technique to restore a dulled grindstone by grinding down its surface and forming new sharp teeth.
Mitsui High-tec CNC surface grinding machine is capable of test dressing for checking the dressing conditions by remote dressing function, as well as automatic dressing during manual operation.
(Related pages: MSG-818CNC-FA catalog)
Electrical sheet
Generic name of silicon steel, low-carbon steel and pure iron; showing little core loss and having excellent magnetic flux density, magnetic permeability, etc.
Main material used for the core of motor, generator, etc. is "silicon steel sheet" that is composed of pure iron and 2 - 3% of silicon. The sheet is stamped into pieces of desired shape one by one, and the pieces are laminated to be a core.
(Related pages: Caulking of thin sheet)
Etching
One of the systems for manufacturing leadframes, wherein the shape of product is printed on metallic material by photographic developing technique and the metallic material is corroded to form a leadframe. Comparing to stamping, this technique is more suitable for high-mix low-volume production.
(Related pages: Features of IC leadframe 2)
Grinding machine
Grindstone
There are two types. The one is a sintered grindstone made of hard particles that are solidified with binder, leaving proper amount of fine pores. The other is a grindstone made of ultra-abrasive particles (of diamond or borazon) solidified by a range. Each of them is used in a surface grinding machine in order to make die tips (punch or die).
(Related pages: Accuracy inspection table)
IC assembly
Assembling of IC package
(Related pages: Features of IC assembly)
IC leadframe
A metal frame to mount IC and to be an external terminal as well
Iron-nickel alloy, copper alloy, etc. are used. Leadframe is a component that has been used since earliest time and brings out high-strength and good heat radiation at a low cost.
Mitsui High-tec is producing IC leadframes both by etching and stamping.
(Related pages: IC leadframe)
IC package
A product in which IC body is protected externally for mounting it onto board. As the application of IC products has become wider and wider, the material, size and shape of package have been diversified.
(Related pages: IC assembly)
Interposer
IC package component parts for jointing semiconductor chip to motherboard, used in the form of a leadframe made of metal such as copper, TAB tape, resin substrate, etc.
(Related pages: Features of IC assembly)
Lead frame
Lead-free
A technique not to use lead that is the cause of environmental pollution. In connecting IC to the board, lead-containing solder is used, which has become an issue of influence of lead to human body and environmental pollution in recent years.
Mitsui High-tec is advancing the development of leadframe needing no solder, lead-free solder and technology of utilizing it.
(Related pages: Ecology / Features of leadframe 3)
Machine tools
Machinery to make a work into specified dimensions and shape through the processes of cutting, grinding, polishing, etc.
(Related pages: Precision machine tools)
µBGA®[Micro BGA]
A kind of CSP whose package size is almost the same as the chip size, having an advantage of being made small nearly as same as a chip, different from other CSPs that become relatively larger than chip in size.
µBGA®is the registered mark of Tesser Technologies, USA.
Mirror finishing
A technique to finish a surface to the extent like mirror or lens
In the case of pressing dies, wear resistance is enhanced and die tip life is elongated by mirror finish. In the case of mold dies, mirror finish contributes to prevent transcription and improve releasing efficiency
(Related pages: Mirror finishing)
MLCSP [Molded Leadframe CSP]
A chip-size package utilizing its leadframe as an interposer. By the use of a leadframe, package of this type has an advantage of low cost comparing to other packages using a board and tape. This type is also applied to high-frequency devices by the adoption of MAP mold.
(Related pages: Features of Mitsui High-tec IC assembly)
Mold dies
Die for forming plastic resin
For example, in the case of IC production, the die of this type is used for sealing the chip with thermosetting resin.
(Related pages: Precision tooling)
Motor core
A motor core is formed by laminating the pieces of material called electrical sheet. There are two techniques in binding after lamination: welding by use of laser and pressure bonding called calking.
Mitsui High-tec completes stamping, weighing, laminating and caulking processes by use of a single die, realizing excellent productivity.
(Related pages: Mitsui High-tec motor core)
NC [Numerical control]
Definition by JIS
Method of control in NC machine tools, wherein the tool position against a work is controlled by a command of corresponding numerical data
Method of digitally controlling a servo mechanism that governs the action of machine tools, etc. by programmed numerical commands
At present, this is also called CNC (Computerized Numerical Control) because of using computers
(Related pages: Mitsui NC school)
One-stamp die
A die possible of producing a product by one stamping. This is called a compound die at present.
(Related pages: History)
Overhaul
Inspection and repair by disassembling a machine, engine, etc. after a certain working period
Mitsui High-tec is answering customer's needs through thoroughgoing after-sales service such as the overhaul of machine tools and maintenance of dies.
(Related pages: Surface grinding machine overhaul business / Die maintenance business)
P.C.S [Palette Changing System]
A pallet changing system capable of changing a work automatically, allowing a long-time unmanned operation because of changing one work to another automatically by preparing next work beforehand.
(Related pages: 818CNCFA+P.C.S / 300CNC+P.C.S)
Punch
Tip used in a pressing tool. Male tool is called punch, and female tool, die. For the tips (punch and die), carbide material is mainly used because of is excellent rigidity and wear resistance.
(Related pages: Precision parts)
QFP [Quad Flat Package]
A kind of IC package
A package in which leads are taken out from four side faces and formed into gull wing shape. Top end of the lead pin is extended outward horizontally for surface mounting. This type is prevailing in the present multi-pin packages having several decades to 300 pins.
(Related pages: IC leadframe / IC assembly)
Ring plating
Rotor
Regardless of its type, a motor consists of rotor and stator. Rotor is a rotating part as its name implies and, to the contrary, the stationary side is called stator.
(Related pages: Dual stamping die / MAC system)
SOJ [Small Outlet J-lead]
A kind of IC package. Comparing to DIP in which lead pins are taken out from the two longer sides of rectangular package, this type is made smaller by reducing the pin pitch to half that of DIP and, furthermore, adopting J-shape lead pin.
This type is mounted on the surface of PCB or inserted via socket. This type has been developed for reducing the occupying area on PCB than DIP.
(Related pages: IC assembly)
SOP [Small Outline Package]
175. A kind of IC package. Thin type of surface-mounted LSI package, wherein the pin pitch is half that of DIP, leads are taken out from the two side faces of package and formed into gull wing shape. This type allows denser mounting than DIP.
(Related pages: IC assembly / IC lineup -Dual-in-Line-)
Spindle
A shaft that rotates
In a surface grinding machine, grindstone is attached to spindle. The spindle is required to have rigidity and rotating accuracy in order to secure high efficiency and high accuracy.
(Related pages: Surface grinding machine overhaul business)
Spot plating equipment
A machine to provide continuous plating of silver, etc. only on the die pad (island) and the inner lead portion of leadframe. By developing this function, it is possible to use a technique called ring plating that is to plate only the inner lead portion without plating the die pad.
(Related pages: IC leadframe)
Stamping
A technique to manufacture products from metallic material by punching with die using a pressing machine
Mitsui High-tec not only manufactures and sells stamping dies but also deals in stamped motor cores and leadframes.
(Related pages: Precision tooling / IC leadframe / Motor core stamping)
Stator
Generic name of stationary parts in motor and generator, normally consisting of stator frame, bearing, stator core, stator winding, etc.
(Related pages: Dual stamping die / MAC system)
STACKED-CSP
A package made by use of tape-type substrate, possible of reducing largely the mounting area thanks to chip-stacking technology.
(Related pages: IC assembly / IC lineup -BGA-)
Stepping motor
A motor that rotates by the input of pulse signal (single-shot waveform that becomes ON for a very short time)
Because a step motor rotates only by a certain specified angle by one input of pulse signal, it is possible to adjust the rotating angle by the number of pulse signal inputs. In addition, by inputting pulse signals at a certain cycle (with constant frequency), it is possible to rotate a step motor continuously according to the frequency.
(Related pages: Motor core dies)
Submicron
1/1000 of 1mm is called micron, and submicron means to be much smaller than micron. To manufacture higher accurate dies and machine tools, parts in submicron order are required.
(Related pages: Motor core / Latest information of MSG-618CNC)
Surface grinding machine
A machine to grind the surface of a work by rotating a grindstone at a high speed, satisfying high accuracy (in surface roughness, dimensions, shape and direction) that cannot be obtained by cutting, as well as capable of grinding high-hardened material such as hardened steel and brittle materials such as heat-resistant alloy, glass and ceramics that cannot be processed by cutting.
(Related pages: Lineup of precision machine tools)
T-CSP [Tape substrate CPS]
A thin and lightweight package by the use of tape-type substrate
Tooling (kanagata)
Generic name of forms made of metal
There are various kinds of dies such as those for pressing, die casting, casting, closed die forging and plastic forming. Die is called mother of mass production because of its nature to allow stable production at the same accuracy.
(Related pages: Precision tooling)
TQFP [Thin Quad Flat Package]
A kind of IC package, having nearly the same shape as QFP. Comparing to QFP, thickness of the package is reduced and, as a result, denser mounting than QFP is possible.
(Related pages: IC lineup -QUAD-)
TRIM & FORM die
A die to cut off the excess portion of leadframe so as to form its shape in the process of manufacturing IC packages
(Related pages: Precision tooling)
TSOP [Thin Small Outline Package]
A thin model of SOP, whose height and pin pitch when mounted are 1.20mm or less and 0.65mm or less respectively.
(Related pages: IC lineup -Dual-in-Line-)
Tungsten carbide
One of the carbide alloys made of tungsten and carbon fired together and hardened. This material is very hard and difficult to process (grind) but used for die tip because of its excellent wear resistance and high compressive strength.
(Related pages: History)
Zirconia
Common name of zirconium dioxide, having 2600C or higher melting point, resistive to wear and corrosion, and excellent in bending strength and toughness.
Mitsui High-tec is engaged also in the tooling of zirconium ceramics as the optimum material for wear-resistant parts.
(Related pages: Typical manufacturing processes)
Zirconium
One of the transition elements belonging to titanium family, atomic symbol: Zr, atomic number: 40, atomic mass: 91.22, silver-gray solid metal.
Amorphous zirconium exists in the form of black powder, which is liable to ignite in the air, hard to corrode and difficult to absorb thermal neutron. Zirconium alloy is used as constituent parts of atomic furnace and chemical equipment.
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