Mitsui High-tec Inc. accomplished the mass-production of IC leadframes by die-stamping for the first time in the world based on our ultra-precision technology base accumulated since the company foundation. We also produce IC leadframes by photo etching in order to respond to customers needs for production with small-volumes, short product life, short delivery periods, and ultra-high pin count leadframes.
Making use of our competitiveness as an IC leadframe manufacturer, we have advanced to the field of IC assembly and are now engaged not only in leadframe-based packages but also in the development and mass-production of organic substrate-based and other packaging. Furthermore, our organic substrates for BGA packaging are manufactured internally. We also support customers in the design, inspection and shipment of semiconductors through a strategic alliance with four semiconductor manufacturers.
We will endeavor to meet our customers' demands in the future, centering on our ultra-precision technology base.
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