Making use of highly accurate etching technology, we can manufacture the interposer for CSP at a low cost.

Making use of our original leadframe etching and half-etching technology, we have developed low-cost interposers for CSP such as SON as well as QFN and BGA.

This leadframe interposer is radically cheaper than conventional organic substrate and tape interposer used for CSP. Moreover, existing equipment such as wire bonding machines can be used to reduce the initial costs when developing new packaging methods.

Half-etch QFN

We can select the production method of leadframes according to the demand of customers. Etching is suitable for the low volume production and new product development, and stamping is suitable for high volume production and cost reduction. As the result, we can cope with rapid changes in industrial circumstances.

Our etched products are designed with stamping conversion in mind, and this reduces conversion time and cost when switching to higher production volumes. Also, the production conversion from etching to stamping is done internally to guarantee a smooth supply ramp up.