We are capable of 0.150mm tip-pitch for inner lead, which is at the topmost in our business field. (0.135mm pitch is under development.)

Leadframes having this ultra-fine pitch enables the lead tip to come nearer than conventional leadframes and, as the result, reduces the consumption of gold wire and increases the wafer efficiency by allowing downsizing of semiconductor chips; thus improving total cost performance.

Mitsui's high accurate deep bending technology made possible small-size packaging such as those for P-VSON and P-VQFN.

The ultra-precision technology base at the origin of our technology, in combination with accurate calculation, has made possible highly accurate and complicated manufacturing technologies indispensable for downsizing packages. These technologies include the deep bending of support bars that support inner leads and islands (die pad), as well as the downset of the island itself. These technologies unlimitedly expand the possibilities of IC packaging by use of leadframes.

Simulation by CAE	Example of bending downset

By highly accurate in-die interlocking technology, we have accomplished the production of leadframes with heat sink that are indispensable for power packaging, etc.


Our ultra-precision technology base enables even high-accurate in-die interlocking and, in the case of leadframes for power packaging which requires excellent performance in heat radiation, we can supply such leadframes at a lower cost than those on which heat sink is stuck with tape, etc.