A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages.
Mitsui High-tec accomplished the production of IC leadframes by precision-die-stamping for the first time in the world and, at present, we are producing leadframes not only by stamping but also by chemical etching.
We supply a wide range of products such as fine pitch leadframes for ultra-multi-pin QFP, deep bent leadframes for P-VQFN/SON, in-die interlocked leadframes for power packaging and electronic parts backed up by our strong-point, that is, a hybrid of ultra-precision technology base and die-manufacturing technology.
A leadframe is a thin layer of metal that connects the wiring from tiny electrical terminals on the semiconductor surface to the large-scale circuitry on electrical devices and circuit boards. Leadframes are used in almost all semiconductor packages. 
History of Mitsui High-tec leadframe development
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