Leadframes are an indispensable component of semi-conductor packaging. The role of a leadframe is to connect IC chip to substrate mechanically.

Mitsui High-tec Inc. made it possible to produce the leadframe by use of a die and realized the mass production of leadframes by stamping for the first time in the world.

Performance required for leadframes is various, and it was very difficult to satisfy such requirements. However, by integrating the technologies, we succeeded in satisfying them and, even at present, we are positively tackling the development of new products.

Feedback of information

No doubt, we make mistakes. But what is important is to find out the causes of the mistakes and feed back the result to the designing work. Only the accumulation of such efforts can make us confident in the dies we produce.

Research toward unknown area ahead

We always pursue an ideal state and try to realize it. We find a breakthrough by examining the problem from various aspects.

Analysis of stress on die by CAE	Analysis of punching strength by CAE

Parts manufactured in sub-micron order

Some dies have a tips thinner than a human hair. In order to punch a leadframe by such a thin tip, it is necessary to secure an accurate clearance and manufacture a precision die that can realize such stamping technology. In addition, punches are available on request. (Details)