As far as customers give us the information of chips, we can be entrusted with all the subsequent processes of development, mass production and test. Namely we are ready to provide customers with a production facility as if it belongs to the customer.
Furthermore we give due consideration for natural environment and are positively tackle the measures to produce lead-free and halogen-free products.
Shortening of TAT under integrated production with use of internally-manufactured interposer
Because we use internally-manufactured leadframes and substrates, we are capable of flexibly supplying interposer that might be a bottleneck in production and shortening the TAT (Turn Around Time).
Example: QFN --> One week is enough for the manufacture of sample (assembly only)
Moreover we can produce leadframes and substrates without stocks, effectively controlling the increase of cost due to excessive quantity of stocks.
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Light, thin and short package QFN by use of a leadframe
QFN is the smallest package in which a leadframe is used as an interposer. After molding, MAP mold is singularized into package pieces by use of a slicer.
Compared with conventional packages such as TSOP and LQFP, QFN is excellent in electric and thermal characteristics. It turns out to be low price compared with other CSP , etc.
Furthermore, if the number of pins is the same as that of conventional package, QFN can be smaller to about 50% of conventional one.
