 Mitsui High-tec Inc. is tackling the development and mass production of IC package and has prepared abundant product lineup backed up by our ultra-precision technology base having been polished since its foundation in order to respond to customers' demand.
We are internally producing IC leadframes and substrates that are the most important components among IC Assembly materials. In addition, by own development of dies, machine tools and jigs, based on our long-accumulated manufacturing technology, we can flexibly respond to the diversified needs arising form development to mass production and supply products in a short delivery term and at a low price.
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Shortening of TAT under integrated production with use of internally-manufactured interposer 
