|
|
History
 |
January,1949 |
Yoshiaki Mitsui, Chairman & CEO of Mitsui High-tec Inc. founded Mitsui Manufacturing as a private enterprise in Tsutsuimachi 1-chome, Yahata City, Fukuoka Prefecture (present Kurosaki 5-chome, Yahatanishi-ku, Kitakyushu City); commenced the manufacture and sale of dies. |
 |
|
January,1949 |
On January 12, the company received an order for notched die from Yaskawa Electric Corporation. (The day was settled to be the date of foundation later.) |
 |
1950 |
Succeeded in the manufacture of own-made surface grinder No.1. |
| 1952 |
Developed a manual calculating machine "Orion". |
|
October,1953 |
Adopted a new manufacturing method by use of precision machine tool, and started the mass production of progressive dies. |
 |
|
March,1954 |
Delivered die No.1 produced by over all grinding after heat treatment. |
|
1955 |
Completed progressive die No.1. |
|
April,1957 |
Mitsui Manufacturing Co., Ltd. was founded at a capital of 1,500-thousand yen. |
|
August,1958 |
Developed a technology for manufacturing tungsten carbide precision progressive die for motor core, and started its manufacture and sale. |
|
January,1959 |
Succeeded in the mass production of carbide die endurable to one million consecutive punching. |
|
June,1959 |
Constructed a three-story reinforced concrete factory building without window in Yahata City, Fukuoka Prefecture (present Kurosaki, Yahatanishi-ku). |
|
|
|
|
January,1960 |
Commenced the construction (the 1st-phase construction was completed in June) of four-story reinforced concrete head office building in Yahata City, Fukuoka Prefecture (present Kurosaki, Yahatanishi-ku). |
 |
| October,1960 |
Constructed Komine Factory (present Head Office / Yahata Plant) |
| May,1961 |
Completed the mass production system of surface grinder, and started its sale. |
| May,1961 |
Opened Chicago Office in Illinois, United States of America. |
|
August,1962 |
Completed the Head Office building in Yahata City, Fukuoka Prefecture (present Kurosaki, Yahatanishi-ku). |
|
December,1962 |
Opened Tokyo Office (present Tokyo Branch) in Tokyo. |
|
April,1963 |
Developed an air grinder, and started its manufacture and sale. |
|
June,1963 |
Started the manufacture and sale of precision filing machine. |
 |
|
September,1963 |
Opened Tokyo Branch by restructuring Tokyo Office. |
|
November,1963 |
Newly constructed Ashiya Factory in Ashiya Town, Fukuoka Prefecture. |
|
April,1964 |
Reorganized Tokyo Branch to Head Office, and old head office, to Kyushu Headquarter. |
|
April,1964 |
Formed a partnership with Blohm, a surface grinder manufacturer of Germany, on technical alliance for surface grinder. |
|
February 1965 |
Newly constructed Oiso Factory in Oiso-machi, Kanagawa Prefecture.
|
|
April,1965 |
Announced the completion of new surface grinder, "Mitsui-Blohm". |
 |
|
May,1965 |
Developed tungsten carbide die for punching IC leadframe. |
|
June,1965 |
Opened a business office in Osaka Prefecture. |
|
January,1966 |
Founded Mitsui Denki Co., Ltd. |
|
February,1967 |
Nagoya Sales Office opened. |
|
November,1967 |
The tungsten carbide precision die delivered to John Ouster & Company, United States of America established a world record, 4.2 million punching by one grinding. |
|
September,1968 |
Developed a powered nostril-hair cutter, "Mini cut". |
|
October,1968 |
Started the production and sale of jig grinder. |
 |
|
December,1968 |
Developed a signal ring. |
|
1968 |
Received the first order for IC leadframe from Texas Instruments, Inc., United States of America. |
|
August,1969 |
Closed Ashiya Factory. |
|
August,1969 |
Newly constructed Nogata Factory (present Nogata Plant) in Nogata City, Fukuoka Prefecture. |
|
|
|
|
March,1970 |
The mass production and sale of IC lead frames stamped by progressive carbide dies started. |
 |
| March,1971 |
Moved Headquarters to Komine Factory. |
| October,1971 |
Opened Sendai Office (present Tohoku Business Office) in Sendai City. |
|
April,1972 |
Founded a locally incorporated company, International Leadframe Corporation in Illinois, United States of America. |
|
December,1972 |
Founded a locally incorporated company, Mitsui Mfg. (Singapore) Pte. Ltd. (present Mitsui High-tec (Singapore) Pte. Ltd.) in Singapore. |
 |
|
January,1973 |
Mitsui Mfg. (Hong Kong), Ltd. (plant) established in Hong Kong (presently Mitsui High-tec (Hong Kong), Ltd.). |
|
August,1974 |
Developed MAC (Mitsui Automatic Core assembly) system, an automatic laminated-core binding system. |
|
August,1974 |
Developed ultra-high speed die carrying out 1450spm. |
 |
|
November,1976 |
Started the sale of a press feeder, Precision Mitsui-Vamco under the license affiliation with Vamco, United States of America. |
|
October,1977 |
Newly constructed Kibita Factory (present Kibita Plant) in Nogata City, Fukuoka Prefecture. |
|
October,1977 |
Started IC leadframe plating business, and developed an automatic continuous spot-plating machine. |
 |
|
November,1977 |
Opened a business office in San Francisco City, United States of America. |
|
February,1979 |
Closed Oiso Factory. |
|
|
|
|
January,1980 |
Founded a locally incorporated company, International Leadframe Corporation in California, United States of America.
|
 |
| March,1980 |
Founded a locally incorporated company, Mitsui Precision Machinery Corporation (present Mitsui High-tec (USA) Incorporated) in Illinois, United States of America. |
|
July,1980 |
Dissolved a locally incorporated company, International Leadframe Corporation in Illinois, United States of America.
|
|
June,1981 |
Developed a punching die thinner than material to be punched, and succeeded in the stamping. |
|
October,1982 |
Completed a four-story building of Yahata Consolidated Head Office Plant in the premises of Komine Factory. |
 |
|
May,1984 |
Changed the corporate name to Mitsui High-tec Inc. |
|
July,1984 |
IC assembly operation started. |
|
September,1984 |
Mitsui High-tec listed on the Fukuoka Stock Exchange. |
 |
|
April,1985 |
Mass-production of IC Leadframes by photo etching process started. |
|
May,1985 |
Yahata Plant phase 2 built on head office grounds. |
|
September1985 |
Mitsui High-tec listed on the Second Section of the Tokyo Stock Exchange. |
|
January,1987 |
Mitsui High-tec (Malaysia) Sdn. Bhd. (plant) established in Malaysia. |
 |
|
March,1987 |
Opened Tohoku Business Office in Sendai City. |
|
April,1988 |
Started the sale of punch and die products. |
|
Octomber,1988 |
Training center is newly established in Kongo, Yahatanishi-ku, Kitakyushu. |
|
|
|
|
June,1991 |
Acquired stocks of Mitsui Electric Co., Ltd. (plant) and established it as a subsidiary. |
 |
| July,1991 |
Mitsui High-tec listed on the First Section of the Tokyo Stock Exchange. |
| August,1991 |
Joined NPS Association. |
|
August,1993 |
Started volume production of stamped 208pin IC leadframes. |
|
October,1993 |
IC Assembly plant is newly established in Kongo, Yahatanishi-ku, Kitakyushu. |
|
November,1993 |
Developed DDTSOP (a thin package with IC on both sides) jointly with Intel, United States of America. |
|
December,1993 |
Beijing Office opened in People's Republic of China . |
 |
|
May,1994 |
Started volume production of stamped 240pin IC leadframes. |
|
July,1994 |
Mitsui High-tec (Tianjin) Co., Ltd. (plant) established in People's Republic of China |
|
August,1994 |
Founded a locally incorporated company, Mitsui High-tec Electronics (Dongguan) Co., Ltd. in People's Republic of China. |
|
September,1994 |
Mitsui High-tec (Philippines) , Inc. (plant) established in Republic of the Philippines. |
 |
|
March,1996 |
Mitsui High-tec (Shanghai) Co., Ltd. (plant) established in People's Republic of China |
|
January,1997 |
Mitsui High-tec (Malaysia) Sdn. Bhd.
(plant) established in Malaysia. |
|
February,1997 |
Started the mass production of µBGA®(µBGA®is federally registered trademark of Tessera, Inc.) based on the technology introduced from Tessera, Inc., United States of America. |
 |
|
August,1997 |
Mitsui High-tec Kumamoto, Co., Ltd. established in Kumamoto. |
|
September,1997 |
An affiliated company Mitsui High-tec (USA) Inc.) Inc. was founded in the United States of America |
|
1997 |
Developed a die for punching the motor core for hybrid car. |
 |
|
April,1998 |
Nobu Plant is newly established in Nobu, Yahatanishi-ku, Kitakyushu. |
|
October,1998 |
Mitsui High-tec (Taiwan), Co., Ltd. established in Kaohsiung, Taiwan. |
|
October,1998 |
Mitsui Engineering Co., Ltd. established. |
 |
|
March,1999 |
Five domestic plants received lSO14001 certification. |
|
April,1999 |
The name of the company of International Leadframe Corporation is changed to Mitsui High-tec (USA) Incorporated. |
|
June,1999 |
Opened Milan Office in Republic of Italy . |
|
December,1999 |
Mitsui High-tec (Thailand) Co., Ltd. (plant) established in Kingdom of Thailand |
|
|
|
|
April,2000 |
Mitsui Technos Co., Ltd. established. |
 |
| July,2000 |
Developed a technology to produce ultra-small (Φ2.7mm) core by MAC system. |
|
October,2000 |
Developed ultra-thin (0.15mm thickness) core by MAC. |
|
March,2001 |
Opened Tokyo Branch by restructuring
Tokyo Business Office.
|
|
|
September,2001 |
Newly constructed Tool and Die Manufacturing Factory in Nobu, Yahatanishi-ku, Kitakyushu City; the 1st-phase construction was completed. |
 |
|
November,2001 |
Started the operation of Tool and Die Manufacturing Factory. |
|
January,2002 |
Opened Toyota Business Office in Toyota City, Aichi Prefecture. |
 |
|
April,2002 |
Completed the 2nd-phase construction of Tool and Die Manufacturing Factory. |
|
May,2002 |
Started the full-scale operation of Tool and Die Manufacturing Factory. |
|
July,2002 |
Merged Mitsui High-tec Kumamoto, Co., Ltd. |
 |
|
July,2002 |
Founded a locally incorporated company, Mitsui (Shanghai) Trading Co., Ltd. in People's Republic of China . |
|
September,2002 |
Mitsui High-tec (Guangdong) Co., Ltd. (plant) established in People's Republic of China . |
|
February,2003 |
Founded Mitsui Stamping Co., Ltd. |
|
February,2003 |
Mitsui Precision Machinery Corporation was merged with Mitsui High-tec (USA) Incorporated and it has been changed a company name by Mitsui High-tec (USA) Incorporated. |
|
February,2004 |
Concentrated the IC assembly business to Kumamoto Plant. |
|
June,2004 |
Opened Stuttgart Office in Federal Republic of Germany. |
|
January,2005 |
Opened Casablanca Office in Kingdom of Morocco. |
|
January,2007 |
Mitsui High-tec (Guangdong) Co., Ltd. was merged with Mitsui High-tec Electronics (Dongguan) Co., Ltd. |
|
February,2008 |
Merged Mitsui Engineering Co., Ltd and Mitsui Technos Co. ,Ltd. |
|
July,2008 |
July 10th Founder, chairman & CEO Yoshiaki Mitsui died. |
|