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History

1949 January,1949 Yoshiaki Mitsui, Founder of Mitsui High-tec commenced the manufacture and sale of dies in Tsutsuimachi 1-chome, Yahata City, Fukuoka Prefecture (present Kurosaki 5-chome, Yahatanishi-ku, Kitakyushu City). 1949 Office building
1950 January,1950 Succeeded in the manufacture of own-made surface grinder No.1.
1952 Developed a manual calculating machine "Orion".
March,1954 Delivered die No.1 produced by over all grinding after heat treatment. The founder in 1949
1955 Completed progressive die No.1.
April,1957 Mitsui Manufacturing was founded at a capital of 1,500-thousand yen.
December,1958 Developed tungsten carbide die(notching type).
May,1959 Developed a technology for manufacturing tungsten carbide precision progressive die for motor core, and started its manufacture and sale.

1960 October,1960 Constructed Komine Factory (present Head Office / Yahata Plant). 1963 Yahata Plant built.
May,1961 Completed the mass production system of surface grinder, and started its sale.
April,1963 Developed an air grinder, and started its manufacture and sale.
June,1963 Started the manufacture and sale of precision filing machine.
April,1964 Formed a partnership with Blohm, a surface grinder manufacturer of Germany, on technical alliance for surface grinder. Work scenery of Komine Factory
April,1965 Announced the completion of new surface grinder, "Mitsui-Blohm".
May,1966 Developed tungsten carbide die for stamping IC leadframe.
August,1966 Opened Chicago office in Illinois, United States of America.
November,1967 The tungsten carbide precision die delivered to John Oster & Company, United States of America established a world record, 4.2 million punching by one grinding.
September,1968 Developed a powered nostril-hair cutter, "Mini cut".
June,1969 The mass production and sale of IC lead frames stamped by progressive carbide dies started.

1970
April,1972 International Leadframe Corporation established in Illinois, United States of America. Mitsui (Singapore) established in Singapore (present Mitsui High-tec (Singapore)).
December,1972 Mitsui (Singapore) established in Singapore (presently Mitsui High-tec (Singapore)).
January,1973 Mitsui (Hong Kong) established in Hong Kong (presently Mitsui High-tec (Hong Kong)). Epoch-making advancement in laminated motor core assembling perfected by developing MAC system, and its
August,1974 Developed ultra-high speed die carrying out 1450spm.
November,1975 Developed MAC (Mitsui Automatic Core assembly) system, an automatic laminated-core binding system.
October,1979 Started IC leadframe plating business, and developed an automatic continuous spot-plating machine.

1970 June,1981 Developed a punching die thinner than material to be punched, and succeeded in the stamping. New consolidated Head Office Plant completed.
October,1982 Completed a four-story building of Yahata Consolidated Head Office Plant in the premises of Komine Factory.
May,1984 Changed the corporate name to Mitsui High-tec.
July,1984 IC assembly business started.
September,1984 Mitsui High-tec listed on the Fukuoka Stock Exchange.
April,1985 Mass-production of IC Leadframes by photo etching process started.
September1985 Mitsui High-tec listed on the Second Section of the Tokyo Stock Exchange.
January,1987 Mitsui High-tec (Malaysia) established in Malaysia.
April,1988 Started the sale of Tooling parts.

1990
June,1991 Acquired stocks of Mitsui Electric and established it as a subsidiary. Kibita Plant
July,1991 Mitsui High-tec listed on the First Section of the Tokyo Stock Exchange.
August,1991 Joined NPS Association.
October,1993 IC Assembly plant is newly established in Kongo, Yahatanishi-ku, Kitakyushu.
December,1993 Opened Beijing Office in People's Republic of China.
July,1994 Mitsui High-tec (Tianjin) established in People's Republic of China. The present Head Office
September,1994 Mitsui High-tec (Philippines) established in Republic of the Philippines.
March,1996 Mitsui High-tec (Shanghai) established in People's Republic of China.
April,1997 Developed a die for punching the motor core for hybrid car.
October,1998 Mitsui High-tec (Taiwan) established in Kaohsiung, Taiwan.
March,1999 Five domestic plants received lSO14001 certification.
December,1999 Mitsui High-tec (Thailand) established in Kingdom of Thailand.

2000 July,2000 Developed a technology to produce ultra-small (Φ2.7mm) core by MAC system. Developed ultra-small (2.7mm) core by MAC.
October,2000 Developed ultra-thin (0.15mm thickness) core by MAC.
September,2001 Newly constructed Tool and Die Manufacturing Factory in Nobu, Yahatanishi-ku, Kitakyushu City; the 1st-phase construction was completed. Started the operation of new Tool and Die Manufacturing Factory.
September,2002 Mitsui High-tec (Guangdong) established in People's Republic of China.
February,2003 Established Mitsui Stamping. Mitsui Stamping established.
July,2008 Founder, chairman & CEO Yoshiaki Mitsui died.