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History

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	January,1949	Yoshiaki Mitsui, Chairman & CEO of Mitsui High-tec Inc. founded Mitsui Manufacturing as a private enterprise in Tsutsuimachi 1-chome, Yahata City, Fukuoka Prefecture (present Kurosaki 5-chome, Yahatanishi-ku, Kitakyushu City); commenced the manufacture and sale of dies.
	January,1949	On January 12, the company received an order for notched die from Yaskawa Electric Corporation. (The day was settled to be the date of foundation later.)
	1950	Succeeded in the manufacture of own-made surface grinder No.1.
	1952	Developed a manual calculating machine "Orion".
	October,1953	Adopted a new manufacturing method by use of precision machine tool, and started the mass production of progressive dies.
	March,1954	Delivered die No.1 produced by over all grinding after heat treatment.
	1955	Completed progressive die No.1.
	April,1957	Mitsui Manufacturing Co., Ltd. was founded at a capital of 1,500-thousand yen.
	August,1958	Developed a technology for manufacturing tungsten carbide precision progressive die for motor core, and started its manufacture and sale.
	January,1959	Succeeded in the mass production of carbide die endurable to one million consecutive punching.
	June,1959	Constructed a three-story reinforced concrete factory building without window in Yahata City, Fukuoka Prefecture (present Kurosaki, Yahatanishi-ku).
	January,1960	Commenced the construction (the 1st-phase construction was completed in June) of four-story reinforced concrete head office building in Yahata City, Fukuoka Prefecture (present Kurosaki, Yahatanishi-ku).
	October,1960	Constructed Komine Factory (present Head Office / Yahata Plant)
	May,1961	Completed the mass production system of surface grinder, and started its sale.
	May,1961	Opened Chicago Office in Illinois, United States of America.
	August,1962	Completed the Head Office building in Yahata City, Fukuoka Prefecture (present Kurosaki, Yahatanishi-ku).
	December,1962	Opened Tokyo Office (present Tokyo Branch) in Tokyo.
	April,1963	Developed an air grinder, and started its manufacture and sale.
	June,1963	Started the manufacture and sale of precision filing machine.
	September,1963	Opened Tokyo Branch by restructuring Tokyo Office.
	November,1963	Newly constructed Ashiya Factory in Ashiya Town, Fukuoka Prefecture.
	April,1964	Reorganized Tokyo Branch to Head Office, and old head office, to Kyushu Headquarter.
	April,1964	Formed a partnership with Blohm, a surface grinder manufacturer of Germany, on technical alliance for surface grinder.
	February 1965	Newly constructed Oiso Factory in Oiso-machi, Kanagawa Prefecture.
	April,1965	Announced the completion of new surface grinder, "Mitsui-Blohm".
	May,1965	Developed tungsten carbide die for punching IC leadframe.
	June,1965	Opened a business office in Osaka Prefecture.
	January,1966	Founded Mitsui Denki Co., Ltd.
	February,1967	Nagoya Sales Office opened.
	November,1967	The tungsten carbide precision die delivered to John Ouster & Company, United States of America established a world record, 4.2 million punching by one grinding.
	September,1968	Developed a powered nostril-hair cutter, "Mini cut".
	October,1968	Started the production and sale of jig grinder.
	December,1968	Developed a signal ring.
	1968	Received the first order for IC leadframe from Texas Instruments, Inc., United States of America.
	August,1969	Closed Ashiya Factory.
	August,1969	Newly constructed Nogata Factory (present Nogata Plant) in Nogata City, Fukuoka Prefecture.
	March,1970	The mass production and sale of IC lead frames stamped by progressive carbide dies started.
	March,1971	Moved Headquarters to Komine Factory.
	October,1971	Opened Sendai Office (present Tohoku Business Office) in Sendai City.
	April,1972	Founded a locally incorporated company, International Leadframe Corporation in Illinois, United States of America.
	December,1972	Founded a locally incorporated company, Mitsui Mfg. (Singapore) Pte. Ltd. (present Mitsui High-tec (Singapore) Pte. Ltd.) in Singapore.
	January,1973	Mitsui Mfg. (Hong Kong), Ltd. (plant) established in Hong Kong (presently Mitsui High-tec (Hong Kong), Ltd.).
	August,1974	Developed MAC (Mitsui Automatic Core assembly) system, an automatic laminated-core binding system.
	August,1974	Developed ultra-high speed die carrying out 1450spm.
	November,1976	Started the sale of a press feeder, Precision Mitsui-Vamco under the license affiliation with Vamco, United States of America.
	October,1977	Newly constructed Kibita Factory (present Kibita Plant) in Nogata City, Fukuoka Prefecture.
	October,1977	Started IC leadframe plating business, and developed an automatic continuous spot-plating machine.
	November,1977	Opened a business office in San Francisco City, United States of America.
	February,1979	Closed Oiso Factory.
	January,1980	Founded a locally incorporated company, International Leadframe Corporation in California, United States of America.
	March,1980	Founded a locally incorporated company, Mitsui Precision Machinery Corporation (present Mitsui High-tec (USA) Incorporated) in Illinois, United States of America.
	July,1980	Dissolved a locally incorporated company, International Leadframe Corporation in Illinois, United States of America.
	June,1981	Developed a punching die thinner than material to be punched, and succeeded in the stamping.
	October,1982	Completed a four-story building of Yahata Consolidated Head Office Plant in the premises of Komine Factory.
	May,1984	Changed the corporate name to Mitsui High-tec Inc.
	July,1984	IC assembly operation started.
	September,1984	Mitsui High-tec listed on the Fukuoka Stock Exchange.
	April,1985	Mass-production of IC Leadframes by photo etching process started.
	May,1985	Yahata Plant phase 2 built on head office grounds.
	September1985	Mitsui High-tec listed on the Second Section of the Tokyo Stock Exchange.
	January,1987	Mitsui High-tec (Malaysia) Sdn. Bhd. (plant) established in Malaysia.
	March,1987	Opened Tohoku Business Office in Sendai City.
	April,1988	Started the sale of punch and die products.
	Octomber,1988	Training center is newly established in Kongo, Yahatanishi-ku, Kitakyushu.
	June,1991	Acquired stocks of Mitsui Electric Co., Ltd. (plant) and established it as a subsidiary.
	July,1991	Mitsui High-tec listed on the First Section of the Tokyo Stock Exchange.
	August,1991	Joined NPS Association.
	August,1993	Started volume production of stamped 208pin IC leadframes.
	October,1993	IC Assembly plant is newly established in Kongo, Yahatanishi-ku, Kitakyushu.
	November,1993	Developed DDTSOP (a thin package with IC on both sides) jointly with Intel, United States of America.
	December,1993	Beijing Office opened in People's Republic of China .
	May,1994	Started volume production of stamped 240pin IC leadframes.
	July,1994	Mitsui High-tec (Tianjin) Co., Ltd. (plant) established in People's Republic of China
	August,1994	Founded a locally incorporated company, Mitsui High-tec Electronics (Dongguan) Co., Ltd. in People's Republic of China.
	September,1994	Mitsui High-tec (Philippines) , Inc. (plant) established in Republic of the Philippines.
	March,1996	Mitsui High-tec (Shanghai) Co., Ltd. (plant) established in People's Republic of China
	January,1997	Mitsui High-tec (Malaysia) Sdn. Bhd. (plant) established in Malaysia.
	February,1997	Started the mass production of µBGA®(µBGA®is federally registered trademark of Tessera, Inc.) based on the technology introduced from Tessera, Inc., United States of America.
	August,1997	Mitsui High-tec Kumamoto, Co., Ltd. established in Kumamoto.
	September,1997	An affiliated company Mitsui High-tec (USA) Inc.) Inc. was founded in the United States of America
	1997	Developed a die for punching the motor core for hybrid car.
	April,1998	Nobu Plant is newly established in Nobu, Yahatanishi-ku, Kitakyushu.
	October,1998	Mitsui High-tec (Taiwan), Co., Ltd. established in Kaohsiung, Taiwan.
	October,1998	Mitsui Engineering Co., Ltd. established.
	March,1999	Five domestic plants received lSO14001 certification.
	April,1999	The name of the company of International Leadframe Corporation is changed to Mitsui High-tec (USA) Incorporated.
	June,1999	Opened Milan Office in Republic of Italy .
	December,1999	Mitsui High-tec (Thailand) Co., Ltd. (plant) established in Kingdom of Thailand
	April,2000	Mitsui Technos Co., Ltd. established.
	July,2000	Developed a technology to produce ultra-small (Φ2.7mm) core by MAC system.
	October,2000	Developed ultra-thin (0.15mm thickness) core by MAC.
	March,2001	Opened Tokyo Branch by restructuring Tokyo Business Office.
	September,2001	Newly constructed Tool and Die Manufacturing Factory in Nobu, Yahatanishi-ku, Kitakyushu City; the 1st-phase construction was completed.
	November,2001	Started the operation of Tool and Die Manufacturing Factory.
	January,2002	Opened Toyota Business Office in Toyota City, Aichi Prefecture.
	April,2002	Completed the 2nd-phase construction of Tool and Die Manufacturing Factory.
	May,2002	Started the full-scale operation of Tool and Die Manufacturing Factory.
	July,2002	Merged Mitsui High-tec Kumamoto, Co., Ltd.
	July,2002	Founded a locally incorporated company, Mitsui (Shanghai) Trading Co., Ltd. in People's Republic of China .
	September,2002	Mitsui High-tec (Guangdong) Co., Ltd. (plant) established in People's Republic of China .
	February,2003	Founded Mitsui Stamping Co., Ltd.
	February,2003	Mitsui Precision Machinery Corporation was merged with Mitsui High-tec (USA) Incorporated and it has been changed a company name by Mitsui High-tec (USA) Incorporated.
	February,2004	Concentrated the IC assembly business to Kumamoto Plant.
	June,2004	Opened Stuttgart Office in Federal Republic of Germany.
	January,2005	Opened Casablanca Office in Kingdom of Morocco.
	January,2007	Mitsui High-tec (Guangdong) Co., Ltd. was merged with Mitsui High-tec Electronics (Dongguan) Co., Ltd.
	February,2008	Merged Mitsui Engineering Co., Ltd and Mitsui Technos Co. ,Ltd.
	July,2008	July 10th Founder, chairman & CEO Yoshiaki Mitsui died.

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